Supply, Delivery and Installation of Sinter Bonding Capability

National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements.

A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages. NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors.

To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements.

The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector.

These stages will be carried out across dedicated research and development cells. The focus of this procurement activity is to acquire a sinter bonding press that is versatile to support both R&D activities and medium volume production.

In the R&D context we require a capability that allows flexible exploration of tooling to achieve different package arrangements, while keeping tool costs at a minimum. In the medium scale production context we require a capability that includes automated handling solutions such that it can be fed by a magazine unstacker, and can feed a magazine stacker. In either context we require the ability to form bonds under inert atmosphere or forming gas, control the pre-heating and post-cooling ramp profile of sinter bonded assemblies and collect detailed sensor-driven time-histories of temperature and pressure for each bonding operation.