Supply, Delivery and Installation of Optical Alignment & Packaging System
University of StrathclydeEstimated Value
Not specified
Deadline
4 September 2026
10 days remaining
Published
3 August 2026
Type
goods
Full Description
Background
The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.
The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.
NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.
Description
The University of Strathclyde has a requirement for optical alignment and packaging system to perform various active and passive alignment functions for photonics packaging applications.
AI Analysis
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Likely incumbents
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- 1
Inseto UK Limited
1 contract wonlatest 13 May 2026
Inseto UK Limited is the most likely incumbent based on recency and category match. To win, bidders typically need a clearly differentiated proposition or a price advantage.
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University of StrathclydeKey Dates
Published
3 August 2026
Submission deadline
4 September 2026
Notice type
tender
Source
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