Supply, Delivery and Installation of Hermetic Sealing Kit
University of StrathclydeEstimated Value
Not specified
Deadline
1 September 2026
Published
30 July 2026
Type
goods
Full Description
Background
The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.
The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.
NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.
Description
The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.
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Likely incumbents
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- 1
Inseto UK Limited
1 contract wonlatest 13 May 2026
Inseto UK Limited is the most likely incumbent based on recency and category match. To win, bidders typically need a clearly differentiated proposition or a price advantage.
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Buyer Profile
University of StrathclydeKey Dates
Published
30 July 2026
Submission deadline
1 September 2026
Notice type
tender
Source
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