Estimated Value
£215,000 – £0
Deadline
16 July 2026
Published
1 July 2026
Type
goods
Overview
Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required. This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise reproducibility should the system be used for light production runs.
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University of BristolKey Dates
Published
1 July 2026
Submission deadline
16 July 2026
Notice type
Contract
Source
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